Joe Maring / Android Authority
TL;DR
- Samsung is reportedly eager about ditching a sophisticated packaging procedure for the Exynos 2700 chipset.
- This is able to doubtlessly outcome within the processor operating warmer, even supposing Samsung is introducing different cooling measures.
- The Exynos 2700 is predicted to energy some Galaxy S27 and S27 Plus fashions subsequent yr.
Some Galaxy S27 and S27 Plus fashions are anticipated to be powered by means of Samsung’s personal Exynos 2700 processor. We’ve already heard the primary rumors about this chipset, however a brand new tale means that the chip may just go through a reasonably relating to trade.
Sisa-Magazine studies that the Exynos 2700 chip may just ditch Fan-Out Wafer-Stage Packaging (FOWLP). Samsung is it seems that eager about leaving behind this complicated production procedure as it’s a pricey procedure and may just additionally impact yield charges.
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This generally is a relating to trade as FOWLP reportedly delivers stepped forward thermal efficiency. This packaging procedure used to be first used at the Exynos 2400, and Samsung claimed on the time that it enabled a “23% bump in heat-resistance when operating on a unmarried core and an 8% growth for multi-core.”
“I heard that whilst making use of WLP to flagship Exynos chips used to be efficient with regards to efficiency and thermal control, it didn’t generate a lot benefit for the reason that packaging itself was very complicated and the yield chance used to be prime,” an business supply advised the hole. “If the amount have been huge, profitability may well be coated to a point, however recently, since it is just being implemented to a portion of the MX industry unit’s personal fashions, the price burden is certain to be heavy.”
It’s no longer all doom and gloom, although. The Exynos 2600 noticed in some Galaxy S26 and S26 Plus variants debuted a heat-path block (HPB) which acts as a warmth sink to scale back heating. Moreover, the Exynos 2700 is predicted to put the DRAM subsequent to the processor quite than on most sensible of the chip. This side-by-side way must permit the HPB to hide each the reminiscence and processor, bettering cooling within the procedure. However will those adjustments be sufficient to offset the loss of a sophisticated packaging procedure? I assume we’ll wish to wait till Exynos 2700-powered telephones land subsequent yr.
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